FCCL ED Copper Foil Quickly details Thickness: 0.012-0.070 mm Width: 5-520 mm Length: 500-5000 M ID: 76 mm,152 mm Alloy: T2,C11000,C1100,C101,E-Cu58 Temperature: High Features: 1. the treated foil in gray or red 2. High profile with properties of LP-S-B/R suitable for FCCL 3. Grain structure of copper foil leads to high flexibility 4. Excellent etching performance 5. low profile enables to make fine circuit pattern Application: 1. Casting and lamination type FCCL 2. Super

20um ED Copper Foil Descrption: ED Copper Foil products producing process is different form the Roll Copper Foils, and it is Electrochemical Theory in the special equipment. The main process technologies are the electrolytic raw copper foil manufacturing and the surface treatment. Producing Process: High-Purity Copper - Dissolution Device - Foil Manufacturing Equipment - Surface Treating Machine - Copper Foils after Surface Treatment - Sheet Cutting Machine ( or Splitting

0.006mm Shielding CCL / PCB Electrolytic Copper Foil Description: Electrolytic copper foil is an important material for the manufacture of copper clad laminates (CCL) and printed circuit boards (PCBs) and lithium ion batteries. In the rapid development of today's electronic information industry, electrolytic copper foil is called the "neural network" of electronic product signal and power transmission and communication. Since 2002, the production value of China's printed

Width 520mm High Purity Red ED Copper Foil Features: 1. the treated foil in gray or red 2. High profile with properties suitable for FCCL 3. Grain structure of copper foil leads to high flexibility 4. Excellent etching performance 5. low profile enables to make fine circuit pattern Application: 1. Casting and lamination type FCCL 2. Super fine pattern FPC 3. Chip on flex (COF) for LED Typical properties of LP-S-B/R ED electrolytic copper foil(for FPC or inner layer of HDI)

High Peel Strength Width 520mm C11000 Insulated Copper Foil Quickly details Thickness: 0.012-0.070 mm Width: 5-520 mm Length: 500-5000 M ID: 76 mm,152 mm Alloy: T2,C11000,C1100,C101,E-Cu58 Temper: H Features: 1. the treated foil in gray or red 2. High peel strength 3. Good etch ability 4. Excellent adhesion to etching resist Application: 1. Phenolic resin board 2. Epoxy board Compare between CA copper foil and ED copper foil 1. Process: rolled copper foil (Rolling process),ED

RF MRI Wall 3oz Thickness Shielding ED Copper Foil Copper Foil Shielding Features: 1. Lightweight (compared with other shielding materials) 2. Copper with 1320mm width or wider , can be more easy to install, especially for roofing, wall and floor. 3. Can be used with either a monolithic RF Floor (moisture resistance) or a modular RF Floor. 4. Copper Serves as an eddy current shield for EMI Protection. 5. RF shielding for MRI rooms is necessary to prevent RF noise from

9um 12um 18um 35un 70um Thickness FPC ED Copper Foil Prodent Feature 1. High tensile strength 2. High Elongation 3. Excellent etchability 4. Eco-friendly products and processes 5. free profile 6. the treated foil is pink Typical Application : FPC, Graphene Carrier Size detail : 1. Thickness: 9um 12um 18um 35un 70um 2. Width :200-1340mm,can be cutting as request,standard width is 1290mm 3. Sample can be supply Typical properties of Low Coarsening Reverse Treated Coppe Foil